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R-XBGA-N12 Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 3x4 (perimeter) array, NSMD pad definition Appendix A Artix-7 BGA, 18x18 grid, 15x15mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=294, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=90, NSMD pad definition Appendix A BGA 324 0.8 CSGA324 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=305, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, 7x7mm body (http://www.analog.com/media/en/technical-documentation/data-sheets/AD7951.pdf, http://www.analog.com/en/design-center/packaging-quality-symbols-footprints/symbols-and-footprints/AD7951.html LFCSP-WD, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_TDFN_2x3_MNY_C04-0129E-MNY.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 54722-0344, 34 Pins per row (http://www.molex.com/pdm_docs/sd/428202214_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 44-Lead Plastic Thin Shrink Small Outline Narrow Body (http://www.analog.com/media/en/technical-documentation/data-sheets/ADuM7640_7641_7642_7643.pdf 24-Lead Plastic QFN (2mm x 3mm) (see Linear Technology DFN_24_05-08-1864.pdf DKD Package; 24-Lead Plastic Shrink Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 32-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 8-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket 14-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 5-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 8x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 7x-dip-switch SPST KingTek_DSHP07TJ, Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 42-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm SMD DIP Switch SPST Slide 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET MQ MOSFET Infineon DirectFET SB MOSFET Infineon DirectFET ME MOSFET Infineon DirectFET ME MOSFET Infineon DirectFET MB MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET S2 MOSFET Infineon DirectFET L6 MOSFET Infineon DirectFET M2 MOSFET Infineon DirectFET L8 MOSFET Infineon DirectFET S1 MOSFET.

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