Labels Milestones
BackExposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf DFN, 6 Pin (https://docs.broadcom.com/docs/AV02-4755EN), generated with kicad-footprint-generator ipc_gullwing_generator.py SOP, 4 Pin (https://ww1.microchip.com/downloads/en/DeviceDoc/DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf.
- [PATCH] light tweaks From cd915e24c94d463c67b0b011c09a1ed6f99bb0bf Mon Sep.
- Traces PCB initial layout.
- { $bread_page_url = $bread->getAttribute('href'); $xpath.