Labels Milestones
Back1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition Appendix A BGA 1924 1 FF1926 FFG1926 FF1927 FFG1927 FFV1927 FF1928 FFG1928 FF1930 FFG1930 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=265, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row (from Kicad 4.0.7), script generated Through hole straight pin header, 2x36, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x09, 2.00mm pitch, double rows Surface mounted pin header THT 1x11 5.08mm single row style1 pin1 left Surface mounted socket strip THT.
- D="m -3.4448821,7.4803212 h -0.19685.
- -4.078850e-02 -3.939388e-03 -9.991600e-01 vertex -1.066064e+02.
- 0.95 4.22131 20.5 vertex 0.95 0.
- -8.83032 3.82299 facet normal -3.694615e-15 -4.690112e-15 1.000000e+00 facet.