Labels Milestones
BackTSSOP HTSSOP 0.65 thermal pad HTSSOP32: plastic thin shrink small outline package; 24 leads; body width 4.4 mm (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54.
- 7.3mm x 6.25mm package, pitch 0.5mm (http://www.analog.com/media/en/package-pcb-resources/package/56702234806764cp_24_3.pdf.
- And/or sell copies of the.
- [.945in] Centerline, Header Only, Palladium.