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(http://www.ti.com/lit/ds/symlink/lm5017.pdf#page=31), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 4 times 1.5 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex CLIK-Mate series connector, B10B-PUDSS (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-113-02-xxx-DV-LC, 13 Pins (http://www.molex.com/pdm_docs/sd/559320530_sd.pdf), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Angled solder pin 1 x 1 mm, 734-137 , 7 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-117-02-xx-DV-TE, 17 Pins per row, Mounting: Snap-in Plastic Peg PCB Lock (http://www.molex.com/pdm_docs/sd/039289068_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 24 Pin (http://pdfserv.maxim-ic.com/package_dwgs/21-0139.PDF), generated with kicad-footprint-generator ipc_gullwing_generator.py SSOP18: plastic shrink small outline package; 40 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 48 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf 24-Lead Plastic QFN (4mm x 3mm) (see Linear Technology DFN_18_05-08-1778.pdf DFN20, 6x5, 0.5P; CASE 506CN (see ON Semiconductor 505AB.PDF DFN22 6*5*0.9 MM, 0.5 P; CASE 506AF\xe2\x88\x9201 (see ON Semiconductor 505AB.PDF DFN22 6*5*0.9 MM, 0.5 P; CASE 506AF\xe2\x88\x9201 (see ON Semiconductor Micro8 (Case846A-02): https://www.onsemi.com/pub/Collateral/846A-02.PDF PSOP44: plastic thin shrink small outline package; 20 leads; body width 3.9 mm; lead pitch 0.635; (see NXP sot054_po.pdf TO-92 horizontal, leads molded, narrow, drill 0.75mm (see NXP sot054_po.pdf TO-126-2, Horizontal, RM 2.286mm SIPAK Horizontal RM 0.97mm Multiwatt-9 staggered type-1 TO-220-4, Vertical, RM 5.08mm, see http://www.vishay.com/docs/88769/woo5g.pdf diode bridge DFS, see http://www.vishay.com/docs/88854/padlayouts.pdf SMD diode bridge OnSemi SDIP-4L, see https://www.onsemi.com/pdf/datasheet/df10s1-d.pdf OnSemi Diode Bridge SDIP-4L SMD diode bridge 9.0mm 8.85mm WOB pitch 5.08mm size 30.5x9.8mm^2 drill 1.3mm pad 2.5mm terminal block Metz Connect Type094_RT03505HBLU pitch 5mm size 40x9.8mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00069 pitch 7.5mm size 59x15mm^2 drill 1.2mm pad 2.3mm terminal block RND 205-00232, 2 pins, diameter 5.0mm z-position of LED center 9.0mm, 2 pins LED diameter 3.0mm z-position of LED center 1.6mm, 2 pins, http://www.kingbright.com/attachments/file/psearch/000/00/00/L-1034IDT(Ver.9A).pdf LED Round Rectangular size 5.0x2.0mm^2 z-position of LED center 1.6mm, 2 pins, http://www.kingbright.com/attachments/file/psearch/000/00/00/L-2774GD(Ver.7B).pdf LED_Rectangular Rectangular Rectangular size 5.0x2.0mm^2 z-position of LED center 9.0mm 2 pins diameter 5.0mm z-position of LED center 1.6mm, 2 pins, pitch 10mm, size 95x9mm^2, drill diamater 1.2mm, pad diameter 2.6mm, see http://www.metz-connect.com/de/system/files/productfiles/Datenblatt_317031_RT10NxxHGLU_OFF-022897S.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal.

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