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Layout tweaks Schematics/Fireball_VCO.pdf | Bin 12821 -> 0 bytes Add circuit blocks to kick drum schematic Add pulldown resistors for reset debounce cap; formatting checkpoint before getting really weird with WireIt dd8c61c34f A couple more GND-stitch vias Latest commits for file Fireball/Fireball_panel.kicad_pro Latest commits for file Datasheets/2N3903-Motorola.pdf # Autorouter files (exported from Eeschema *.net # Autorouter files (exported from Pcbnew # Exported BOM files Upload files to '3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels' c58f541d7e93b3fa0676ab29736db865cc42ef96 Delete '3D Printing/AD&D 1e spell names rendered as raster using Filmoscope Quentin History e825437e5d Upload files to '3D Printing/Panels/AD&D 1e spell names in Filmoscope Quentin' Final tweaks before fabbing; Kosmo_panel lib update Change op amp, dims to user drawings Add comments and graphics symbols to schematics Merge pull request synth_mages/MK_SEQ#2 b77534e3fc Added schmancy pcb for v1 build - C1 is too small; need more than 100k to get 1:1 between schematic and PCB, .../Unseen Servant/Unseen Servant.kicad_sch | 785 **UI:** edits README.md file again edits README.md file again gets comfier with gitignore and git rm --cache b284a71188b23f9f8c43bee1fcce2820249f4384 learns about gitignore and git rm --cache 7130143159 learns about gitignore and git rm --cache corrects inexplicably begreebled lower thre knob labels; confirms mask color is as defined replaces FIREBALL mask/etch with silkscreen fd8b2dd8a7 adds ideas for a single 1.5 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 3.5mm, size source Multi-Contact FLEXI-E 0.1 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator connector JST SUR series connector, S10B-XH-A-1 (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 4-Lead Plastic Small Outline (SS)-5.30 mm Body [QFN]; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l031f6.pdf WLCSP-25, 5x5 raster, 2.133x2.070mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152zd.pdf WLCSP-64, 8x8 raster, 4.466x4.395mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f401vc.pdf WLCSP-49, 7x7 raster, 2.965x2.965mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UCBGA-49, 7x7 raster, 3.277x3.109mm package, pitch 0.5mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f429ng.pdf UFBGA-201, 15x15 raster, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA Texas Instruments, DSBGA, area grid, YBJ0008 pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g031y8.pdf ST WLCSP-20, ST die ID 469, 4.02x4.27mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l412t8.pdf ST WLCSP-49, ST die ID 469, 4.02x4.27mm, 81 Ball, 9x9 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, QFM MOF0009A.

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