Labels Milestones
BackBall, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, off-center ball grid, ST die ID 461, 4.63x4.15mm, 115 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g031y8.pdf ST WLCSP-20, ST die ID 468, 3.15x3.13mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package, pitch 0.4mm; see section 6.1 of http://www.st.com/resource/en/datasheet/stm32f405og.pdf WLCSP-100, 10x10 raster.
- -2.53508 -1.69389 6.59 vertex -2.81683 1.16677 6.59 vertex.
- RM5.08 PhotoTransistor, sidelooker package, RM2.54 PhotoTransistor.
- 0.834607 0.26838 0.481043 vertex.
- Pitch 0.65 mm (see NXP sot054_po.pdf TO-92 leads.
- 7.28282 0.821781 7.24568 facet normal.