Labels Milestones
BackDevelopment board https://www.olimex.com/Products/IoT/ESP8266/MOD-WIFI-ESP8266-DEV/resources/dimensions-WIFI-ESP8266-DEV.png Vibration motor, 2.3-3.2V, 14000rpm, 0.7G, https://www.vybronics.com/wp-content/uploads/datasheet-files/Vybronics-VZ30C1T8219732L-datasheet.pdf Broadcom LGA, 8 Pin (https://www.onsemi.com/pub/Collateral/509AF.PDF), generated with kicad-footprint-generator Molex PicoBlade Connector System, 5268-14A, 14 Pins per row (http://www.molex.com/pdm_docs/sd/530480210_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-118-02-xxx-DV-A, 18 Pins (https://www.molex.com/pdm_docs/sd/026605050_sd.pdf), generated with kicad-footprint-generator connector Molex Mega-Fit top entry JST XH series connector, 502382-1470 (http://www.molex.com/pdm_docs/sd/5023820270_sd.pdf), generated with kicad-footprint-generator Molex PicoBlade series connector, SM08B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, SM15B-ZESS-TB (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0230, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, LY20-14P-DT1, 7 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ103130.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-116-02-xxx-DV, 16 Pins (http://www.molex.com/pdm_docs/sd/555600207_sd.pdf), generated with kicad-footprint-generator JST PUD series connector, BM05B-GHS-TBT (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator Harting har-flexicon series connector, SM20B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 4 times 1.5 mm² wires, basic insulation, conductor diameter 2.4mm, see http://www.4uconnector.com/online/object/4udrawing/10689.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block Phoenix PT-1,5-14-3.5-H pitch 3.5mm size 35x7.6mm^2 drill 1.2mm pad 2.4mm Terminal Block 4Ucon ItemNo. 10706, vertical (cable from top), 6 pins, single row Through hole IDC box header THT 2x12 2.00mm double row surface-mounted straight pin header, 2x07, 2.00mm pitch, 6.35mm socket length, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole angled pin header SMD 2x17 1.00mm double row surface-mounted straight pin header, 2x06, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf SMD vertical IDC header triangle being so far out 5e32fb4fc0 Change transistor footprint to inline_wide, fix DRC ground plane 56529bef3a0c7d0b31cfccd6b6ce971fb35b4e9c Updates from real TL0x4s Merge pull request 'More schematics' (#3) from schematic into main 3d279dd88c Finish schematic, add PDF' (#2) from schematic by Eeschema 5.1.10-88a1d61d58~88~ubuntu20.04.1 | Refs | Qty | Component | Description | Manufacturer | Part | Vendor | SKU | | | | | | | | R14 | 1 | LM358 | Low-Power, Dual Operational Amplifiers, DIP-14/SOIC-14 Low-Power, Dual Operational Amplifiers, DIP-14/SOIC-14 | | | D3, D4, D5, D6, D7, D8, D9, D10 | 8 "active_layer_preset": "All Layers", "active_layer_preset": "All Copper Layers", re-re-remove the mysterious extra.
- 4.99768 5.42659 6.90571 vertex.
- Normal 5.035336e-001 2.241906e-003 8.639727e-001 vertex -4.122093e+000.
- Module. Layout and panel are Kosmo format. .
- Connector, 64800911622 (https://katalog.we-online.com/em/datasheet/6480xx11622.pdf), generated with kicad-footprint-generator Samtec.