Labels Milestones
Back0.35mm pad, 17.0x17.0mm, 292 Ball, 20x20 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=23 FBGA-96, 13.5x7.5mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=23 FBGA-96, 13.5x7.5mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-bga/05081600_0_bga49.pdf https://www.analog.com/media/en/technical-documentation/product-information/assembly-considerations-for-umodule-bga-lga-package.pdf BGA 324 0.8 CS325 CSG235 Spartan-7 BGA, 14x14 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double rows Through hole angled socket strip, 1x39, 2.54mm pitch, double rows Through hole straight socket strip, 2x37, 1.27mm pitch, single row style2 pin1 right Through hole pin header THT 2x14 1.27mm double row Through hole angled pin header THT 2x36 1.27mm double row Through hole pin header SMD 1x08 2.54mm single row (from Kicad 4.0.7), script generated Through hole pin header THT 1x32 1.27mm single row (from Kicad 4.0.7), script generated Through hole socket strip THT 2x27 2.00mm double row Through hole socket strip THT 1x23 2.54mm single row Surface mounted socket strip SMD 2x17 1.27mm double row Through hole angled socket strip THT 2x21 2.54mm double row surface-mounted straight pin header, 2x25, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf.
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