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3-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 22-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 14-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 16-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 3x-dip-switch SPST , Slide, row spacing 22.86 mm (900 mils), Socket 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x4.1mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 1x-dip-switch SPST Copal_CHS-01B, Slide, row spacing 10.16 mm (400 mils), Socket, LongPads 28-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 12-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 20-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 6.7x11.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 12x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP 2.54mm 10.16mm 400mil 4-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 10x-dip-switch SPST , Piano, row spacing 8.89 mm (350 mils), body size 10.8x19.34mm 7x-dip-switch SPST Omron_A6S-710x, Slide, row spacing 8.9 mm (350 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 2x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket 6-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 6-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 12-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 28-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size 9.78x9.8mm (see e.g. Http://www.ti.com/lit/ds/symlink/drv5023.pdf TO-92L leads in-line (large body variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x29.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 8x-dip-switch SPST Omron_A6H-8101, Slide, row spacing 25.4 mm (1000 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 10-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 20-lead though-hole mounted high-volatge DIP package (based on http://www.latticesemi.com/view_document?document_id=213 Lattice caBGA-756, ECP5 FPGAs, 27.0x27.0mm, 756 Ball, 32x32 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=26 ST uTFBGA-36, 0.25mm pad, 3.6x3.6mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l496wg.pdf ST.

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