Labels Milestones
BackOutline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads THT DIP DIL PDIP SMDIP 2.54mm 11.48mm 451mil 6-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 9.78x7.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile DIP Switch SPST Slide 7.62mm 300mil SMD 2x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL.
- -0.0600054 0.14487 0.98763 vertex 4.63084.
- Pitch=5.00mm, diameter=19mm, Supercapacitor, http://www.elna.co.jp/en/capacitor/double_layer/catalog/pdf/dx_e.pdf CP Radial series.