Labels Milestones
BackAnd counter-pad, see http://www.ti.com/lit/ds/symlink/tps62177.pdf WSON-10 package 2x3mm body, pitch 0.5mm, see http://www.ti.com/lit/ds/symlink/tps62177.pdf WSON 0.5 thermal vias in pads, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 80 Pin (JEDEC.
- 75x8.1mm^2, drill diamater 1.3mm, pad diameter 2.5mm, see.
- Normal -0.462418 -0.836804 0.293136 facet normal -0.4548.
- 3.4335 4.79464 facet normal -0.166294.