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Micro-MaTch female-on-board top-entry thru-hole 8 pin package (http://datasheet.octopart.com/ZDT6758TA-Zetex-datasheet-68057.pdf Diodes Incorporated PowerDI3333-8, Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf DFN package size 0604 3 pins U-DFN2510-10 package used by Diodes Incorporated PowerDI3333-8, Plastic Dual Flat, No Lead Package - 9x9 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 32-lead dip package, row spacing 5.08mm, pin-spacing 2.54mm, see https://www.njr.com/semicon/PDF/package/TO-220F-4_E.pdf TO-220F-4 Vertical RM 2.54mm TO-220-4, Vertical, RM 0.97mm, Multiwatt-9, staggered type-1 TO-220-11, Horizontal, RM 2.29mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-2 Horizontal RM 1.7mm MultiwattF-11 staggered type-1 TO-220-7 Horizontal RM 2.54mm staggered type-1 TO-220-9 Vertical 2.54mm Pitch (http://www.st.com/resource/en/datasheet/tda7264.pdf TO-220-9 Vertical RM 2.54mm TO-220-3, Vertical, RM 0.97mm, Multiwatt-9, staggered type-1 TO-220-8 (Multiwatt8), Vertical, 2.54mm Pitch (http://www.st.com/resource/en/datasheet/tda7264.pdf TO-220-9 Vertical RM 2.54mm TO-220F-4, Horizontal, RM 2.29mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-3 Vertical RM 2.54mm TO-218-2, Horizontal, RM 5.08mm, see http://www.onsemi.com/pub/Collateral/FFPF10F150S-D.pdf TO-220F-2 Horizontal RM 1.7mm PentawattF- MultiwattF-5 TO-220F-5, Vertical, RM 4.58mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-2 Horizontal RM 2.54mm TO-220F-3, Vertical, RM 4.58mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf.

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