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Version, http://www.cree.com/~/media/Files/Cree/LED%20Components%20and%20Modules/XLamp/Data%20and%20Binning/ds%20XHP70.pdf LED Cree-XQ handsoldering pads http://www.cree.com/~/media/Files/Cree/LED-Components-and-Modules/XLamp/Data-and-Binning/ds-XQB.pdf LED SMD 3mm Right Angle series (http://www.dialightsignalsandcomponents.com/Assets/Drawings/2D_Drawings_DrawingDetailedSpec/C17354.pdf RGB LED NeoPixel Nano, 12 mA, https://cdn-shop.adafruit.com/product-files/4684/4684_WS2812B-2020_V1.3_EN.pdf LED RGB NeoPixel Mini PLCC-4 3535 5.0mm x 5.0mm Addressable RGB LED NeoPixel, https://cdn-shop.adafruit.com/product-files/2686/SK6812MINI_REV.01-1-2.pdf LED RGB PLCC-6 CLP6C-FBK LED, RGB, right-angle, clear, https://everlightamericas.com/index.php?controller=attachment&id_attachment=3220 3.2mm x 2.8mm PLCC4 RGB LED, through hole, DF11-24DP-2DSA, 12 Pins per row (https://www.molex.com/pdm_docs/sd/430450221_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 64-Lead Plastic Quad Flat, No Lead Package (ML) - 8x8x0.9 mm Body [TQFP] With Exposed Pad Variation; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot158-1_po.pdf VSO56: plastic very small outline package; 44 leads; body width 3.9 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 24 leads; body width 4.4 mm; (see NXP sot054_po.pdf TO-92 leads molded, wide, drill 0.75mm, hand-soldering variant with enlarged pads (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54 PA33 diode SOD70 2-pin TO-92 horizontal, leads molded, narrow, drill 0.75mm (see NXP sot054_po.pdf TO-92 2-pin variant by Heraeus, drill 0.75mm TO-92Flat package, often used for hall sensors, drill 0.75mm (https://www.diodes.com/assets/Package-Files/TO92S%20(Type%20B).pdf TO-92 leads in-line, narrow, oval pads, drill 0.75mm (see NXP sot054_po.pdf TO-92 2-pin leads in-line, wide, drill 0.75mm (http://www.produktinfo.conrad.com/datenblaetter/175000-199999/181293-da-01-de-TO92_Temperatursensor_PT1000_32209225.pdf Molded Japan Transistor Package 7x4x9mm^3, http://rtellason.com/transdata/2sb734.pdf Non Isolated Modified TO-220 7pin Package, see http://www.farnell.com/datasheets/5793.pdf Power Integration Y Package SIPAK, Horizontal, RM 1.7mm, Pentawatt, Multiwatt-5, staggered type-1, see http://www.ti.com/lit/ds/symlink/lm3886.pdf TO-220F-11 Vertical RM 1.27mm staggered type-1 TO-220F-9 Vertical RM 5.475mm SOT-93 TO-220-2, Horizontal, RM 10.95mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf TO-218-3 Vertical RM 1.27mm Multiwatt-7 staggered type-2 TO-220-4 Vertical RM 1.7mm PentawattF- MultiwattF-5 TO-220F-7, Vertical, RM 0.9mm, staggered type-2 TO-220-5, Horizontal, RM 1.7mm, Pentawatt, Multiwatt-5, see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-to-220/to-220_5_05-08-1421_straight_lead.pdf TO-220-5 Horizontal RM 5.45mm TO-3PB-3, Horizontal, RM 1.27mm, staggered type-2, see http://www.st.com/resource/en/datasheet/l298.pdf TO-220-15 Vertical RM 2.54mm staggered type-1 TO-220-7 Horizontal RM 3.81mm TO-264-5, Vertical, RM 10.9mm, see https://diotec.com/tl_files/diotec/files/pdf/datasheets/pb1000.pdf Single phase bridge rectifier case 16.7x16.7 Vishay GBU rectifier diode bridge 9.0mm 8.85mm WOB pitch 5.0mm 4-lead round diode bridge Thermal enhanced ultra thin SMD package; 3 leads; body: 4.3x6.1x0.43mm, https://www.vishay.com/docs/95570/to-277asmpc.pdf 3-pin TSOT23 package, http://cds.linear.com/docs/en/packaging/SOT_8_05-08-1637.pdf Texas Instrument DRT-3 1x0.8mm Pitch 0.7mm http://www.ti.com/lit/ds/symlink/tpd2eusb30.pdf DRT-3 1x0.8mm Pitch 0.7mm Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303, NSMD pad definition Appendix A BGA 196 0.5 CPGA196 Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition Appendix A Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=271, ttps://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=281, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=82, NSMD pad definition (http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid.

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