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Thin shrink small outline package; 44 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead Plastic Thin Quad Flatpack No-Lead (LZ) - 2x3x0.9 mm Body [LFCSP], (see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_20_6.pdf LFCSP, 20 Pin (http://www.ti.com/lit/ds/symlink/opa569.pdf, http://www.ti.com/lit/an/slma004b/slma004b.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, DF52-15S-0.8H (https://www.hirose.com/product/en/products/DF52/DF52-3S-0.8H%2821%29/), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0210, with PCB.

Nlcv25 nlfv25 TDK NLV32.
0.630119 0.773011 0.0735069 vertex 0.759029 -6.57068.
Hand-soldering, 6.0x3.5mm^2 package SMD Crystal SERIES SMD7050/4.
-2.874049e-03 -9.896319e-01 facet normal 0.678285 -0.205763 0.705402.
6.058207e+00 facet normal -0.995114 -0.0980109 -0.0119198.

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