Labels Milestones
BackQuad Flat, No Lead Package (MF) - 3x3x0.9 mm Body [HTSSOP], with thermal vias in pads, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: 26-60-4090, 9 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py Plastic Small Outline (ST)-4.4 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils THT.
- -1.040802e+02 9.627468e+01 2.550000e+00 facet normal.
- S9B-XH-A-1 (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py.
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