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Lead pitch 0.635; (see http://cds.linear.com/docs/en/datasheet/38901fb.pdf 28-Lead Plastic Shrink Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil SMDSocket SmallPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x21.88mm 8x-dip-switch SPST KingTek_DSHP08TS, Slide, row spacing 8.61 mm (338 mils), body size 9.78x25.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 4x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 6.7x9.18mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 7x-dip-switch SPST KingTek_DSHP07TJ, Slide, row spacing 11.48 mm (451 mils 20-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 10-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 16-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), Socket, LongPads THT DIP DIL ZIF 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET SQ MOSFET Infineon DirectFET MQ MOSFET Infineon DirectFET MB MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET S2 MOSFET Infineon PLCC, 20 pins, dual row male, vertical entry Harwin LTek Connector, 7 pins, pitch 5.08mm, size 35.6x8.45mm^2, drill diamater 1.2mm, pad diameter 3mm, see , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_4Ucon THT Terminal Block WAGO 236-424, 45Degree (cable under 45degree), 4 pins, pitch 5.08mm, size 71.1x11.2mm^2, drill diamater 1.2mm, pad diameter 2.5mm.

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