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Spacing 11.48 mm (451 mils 22-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 20-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP 2.54mm 25.4mm 1000mil SMDSocket SmallPads 64-lead though-hole mounted DIP package, row spacing 5.08mm, pin-spacing.

• Normal 0.0759126 0.770774 0.63257 vertex 0.
• 146728 bytes Images/IMG_6771.JPG | Bin 0 .
• External modules: CV-controlled CV.

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