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2x21, 2.00mm pitch, double rows Through hole socket strip THT 1x23 1.27mm single row Through hole IDC header, 2x15, 2.54mm pitch, 6mm pin length, double rows Surface mounted socket strip SMD 1x33 1.00mm single row Through hole straight pin header, 2x12, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf SMD vertical IDC box header THT 1x25 1.00mm single row style2 pin1 right Through hole angled socket strip THT 1x19 2.54mm single row style1 pin1 left Surface mounted pin header SMD 1x18 2.00mm single row style1 pin1 left Surface mounted socket strip SMD 2x20 1.27mm double row Through hole pin header SMD 1x09 2.00mm single row style1 pin1 left Surface mounted pin header SMD 2x37 2.00mm double row surface-mounted straight pin header, 1x04, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, 4x4mm body, pitch 0.5mm, see http://www.ti.com/lit/ds/symlink/tps62177.pdf WSON 0.5 thermal vias in pads, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py VQFN, 16 Pin (https://www.renesas.com/eu/en/www/doc/datasheet/isl8117.pdf#page=22), generated with kicad-footprint-generator connector Molex Micro-Fit_3.0 side entry Molex LY 20 series connector, B15B-XASK-1-A.

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