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Outline http://www.ti.com/lit/ml/mpds158c/mpds158c.pdf VSO40: plastic very small outline package; 10 leads; body width 3.9 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot190-1_po.pdf VSSOP-8 2.3x2mm Pitch 0.5mm SON, 8-Leads, Body 5x6x1mm, Pitch 1.27mm; (see Texas Instruments EUS 5 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils THT DIP DIL PDIP SMDIP 2.54mm 7.62mm 300mil LongPads 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 42-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see http://cdn-reichelt.de/documents/datenblatt/A400/HDBL101G_20SERIES-TSC.pdf DIL DIP PDIP 5.08mm 7.62mm 300mil LowProfile 1x-dip-switch SPST , Slide, row spacing 8.9 mm (350 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 5x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils THT DIP DIL ZIF 15.24mm 600mil Socket LongPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 28-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size 10.8x29.5mm 11x-dip-switch SPST , Slide, row spacing 10.16 mm (400 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 42-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 10-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD DIP Switch SPST Slide 7.62mm 300mil Three phase, Bridge, Rectifier 4-lead round diode bridge Vishay KBU rectifier diode bridge.

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