3
1
Back

7x7x1.0 mm Body, 2.00 mm Footprint [HTQFP] thermal pad with vias HTSSOP, 20 Pin (JEDEC MS-012AB, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_14.pdf), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 53048-0410, 4 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf.

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