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Chemi-Con, 8.0x6.7mm SMD capacitor, aluminum electrolytic, Nichicon, 6.3x4.5mm SMD capacitor, aluminum electrolytic, Panasonic C6, 6.3x5.9mm SMD capacitor, aluminum electrolytic, Nichicon, 8.0x5.4mm SMD capacitor, aluminum electrolytic, Rubycon, 8.0x6.5mm SMD capacitor, aluminum electrolytic nonpolar, 6.3x5.4mm SMD capacitor, aluminum electrolytic nonpolar, 5.0x5.8mm SMD capacitor, aluminum electrolytic, Vishay 1821, 18.0x22.0mm, http://www.vishay.com/docs/28395/150crz.pdf Capacitor SMD 0504 (1310 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size from: http://datasheets.avx.com/AVX-HV_MLCC.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 14-Lead Plastic DFN (7mm x 4mm) (see Linear Technology DFN_24_05-08-1864.pdf DKD Package; 24-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_16_05-08-1709.pdf DHC Package; 16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad; (http://www.ti.com/lit/ds/symlink/drv8833.pdf HTSSOP, 16 Pin (http://www.ti.com/lit/ds/sbos354a/sbos354a.pdf, JEDEC MO-220 variation VJJD-2), generated with kicad-footprint-generator JST GH series connector, BM15B-ZESS-TBT (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 4-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 6.7x19.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 1x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 40-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size 6.7x32.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 8x-dip-switch SPST Omron_A6S-810x, Slide, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 1x-dip-switch SPST , Piano, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 28-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 10.8x9.18mm 3x-dip-switch SPST , Piano, row spacing 5.08mm, pin-spacing 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf.

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