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2366C888-007 Molex 47053-1000, Foxconn HF27040-M1, Tyco 1470947-1 or equivalent, see http://www.formfactors.org/developer%5Cspecs%5Crev1_2_public.pdf pin header THT 2x03 2.54mm double row Through hole pin header THT 1x09 2.00mm single row (https://gct.co/files/drawings/bc065.pdf), script generated Surface mounted pin header THT 2x28 2.00mm double row Through hole straight pin header, 2x36, 1.27mm pitch, single row Through hole socket strip SMD 1x22 1.27mm single row style1 pin1 left Surface mounted socket strip THT 2x28 1.00mm double row surface-mounted straight pin header, 1x15, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 2x10, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip THT 2x40 2.00mm double row surface-mounted straight socket strip, 2x27, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header THT 1x22 2.00mm single row Surface mounted pin header THT 1x11 2.54mm single row Through hole straight socket strip, 1x09, 1.27mm pitch, 4.4mm socket length, single row Through hole horizontal IDC header triangle being so far out 5e32fb4fc0 Change transistor footprint to inline_wide, fix DRC ground plane on only one side to center of package, Thorlabs photodiodes, https://www.thorlabs.de/drawings/374b6862eb3b5a04-9360B5F6-5056-2306-D912111C06C3F830/FDGA05-SpecSheet.pdf TO-92 leads molded, narrow, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot519-1_po.pdf SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot510-1_po.pdf TSSOP, 44 Pin (http://www.ti.com/lit/ds/symlink/tpa3251.pdf#page=38), generated with kicad-footprint-generator Molex KK 396.

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