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Instruments BGA-289, 0.4mm pad, 15x15mm, 289 Ball, 17x17 Layout, 0.8mm Pitch, https://www.ti.com/lit/ml/mpbg777/mpbg777.pdf BGA 289 0.8 ZAV S-PBGA-N289 Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A Spartan-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=77, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double rows Through hole angled pin header, 2x20, 2.54mm pitch, 8.51mm socket length, double cols (from Kicad 4.0.7), script generated Surface mounted pin header SMD 1x18 1.00mm single row Surface mounted socket strip SMD 2x08 1.27mm double row surface-mounted straight socket strip, 2x02, 2.00mm pitch, single row style1 pin1 left Surface mounted socket strip SMD 1x24 2.54mm single row style1 pin1 left Surface mounted socket strip THT 2x09 1.27mm double row Through hole angled socket strip THT 1x25 1.27mm single row (from Kicad 4.0.7), script generated Through hole angled pin header THT 1x11 1.27mm single row Through hole straight pin header, 1x12, 1.27mm pitch, 4.4mm socket length, double rows Through hole angled socket strip, 1x13, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole socket strip SMD 1x10 1.27mm single row Through hole angled socket strip THT 1x14 5.08mm single row style2 pin1 right Through hole socket strip THT 1x10 1.00mm single row Through hole straight socket strip, 1x38, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight.

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