3
1
Back

Pitch, YFF0006, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole IDC header, 2x30, 2.54mm pitch, 8.51mm socket length, single row Through hole angled socket strip SMD 1x38 1.27mm.

New Pull Request