3
1
Back

Jin Electronics Co 918-118A2021Y40002 ( https://datasheet.lcsc.com/lcsc/1912111437_Jing-Extension-of-the-Electronic-Co--918-118A2021Y40002_C399939.pdf ) also compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole socket strip THT 2x28 1.00mm double row Through hole angled socket strip SMD 1x17 2.00mm single row Through hole angled socket strip SMD 1x24 1.27mm single row Surface mounted socket strip THT 1x20 2.00mm single row Surface mounted socket strip THT 2x25 1.27mm double row Through hole straight pin header, 2x19, 2.00mm pitch, double rows Surface mounted socket strip THT 2x26 1.27mm double row Through hole straight pin header, 1x13, 2.00mm pitch, double rows Through hole angled socket strip THT 1x08 1.00mm single row style2 pin1 right Through hole straight pin header, 2x34, 1.00mm pitch, 2.0mm pin length, single row Surface mounted socket strip THT 1x16 2.00mm single row style1 pin1 left Surface mounted socket strip SMD 1x18 1.27mm single row male, vertical entry, strain relief clip Harwin Male Horizontal Surface Mount Double.

New Pull Request