Labels Milestones
BackBump 2x3 (perimeter) array, NSMD pad definition Appendix A BGA 484 1 FB484 FBG484 FBV484 Artix-7, Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition Appendix A BGA 1156 1 RF1157 RF1158 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=305, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=305, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double rows Through hole straight socket strip, 2x05, 2.00mm pitch, single row Surface mounted pin header SMD 1x20 1.00mm single row style1 pin1 left Surface mounted socket strip SMD 1x03 2.00mm single row Through hole pin header THT 2x02 2.00mm double row surface-mounted straight pin header, 2x35, 1.27mm pitch, double rows Surface mounted pin header THT 1x09 2.00mm single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole socket strip SMD 2x28.
- Merge, publish, distribute, sublicense.
- -1.103843e+02 9.755134e+01 1.512829e+01 vertex -1.103843e+02 9.755134e+01.