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With SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package.

• 43160-2106, With thermal vias.
• -9.72545 -0.133431 2.66152 facet normal -0.302869 0.92061 0.246468.
• -2.845792e-001 -4.980125e-001 8.191448e-001 facet normal -0.962633 0.191482 -0.191502.

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