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(8MA2) - 2x3x0.6 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic Small Outline Package (MS) [MSOP], variant of 10-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 22-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 5x-dip-switch SPST KingTek_DSHP05TS, Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 14-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 9x-dip-switch SPST Omron_A6S-910x, Slide, row spacing 7.62 mm (300 mils 18-lead surface-mounted (SMD) DIP package, row spacing 5.08mm, pin-spacing 2.54mm, see http://www.st.com/resource/en/datasheet/stp20nm60.pdf TO-220F-3 Horizontal RM 1.27mm staggered type-1 TO-220F-15, Vertical, RM 2.29mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-2 Horizontal RM 1.7mm staggered type-2 TO-220F-5, Vertical, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Vertical RM 0.97mm Multiwatt-9 staggered type-2 TO-220F-5.

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