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Back= Socket_Arduino_Nano:Socket_Strip_Arduino_1x15; EndCmp BeginCmp TimeStamp = /551D94EF; Reference = P1; ValeurCmp = CONN_1; IdModule = Socket_Arduino_Nano:Socket_Strip_Arduino_1x15; EndCmp BeginCmp TimeStamp = /551D9414; Reference = P5; ValeurCmp = CONN_1; IdModule = Socket_Arduino_Nano:1pin_Nano; EndCmp BeginCmp TimeStamp = /551D9380; Reference = P3; ValeurCmp = Analog; IdModule = Socket_Arduino_Nano:1pin_Nano; EndCmp BeginCmp TimeStamp = /551D9380; Reference = P4; ValeurCmp = CONN_1; IdModule = Socket_Arduino_Nano:Socket_Strip_Arduino_1x15; EndCmp BeginCmp TimeStamp = /551D9432; Reference = P4; ValeurCmp = Digital; IdModule = Socket_Arduino_Nano:1pin_Nano; EndCmp BeginCmp TimeStamp = /551D9496; Reference = P1; ValeurCmp = CONN_1; IdModule = Socket_Arduino_Nano:1pin_Nano; EndCmp BeginCmp TimeStamp = /551D9496; Reference = P4; ValeurCmp = Analog; IdModule = Socket_Arduino_Nano:1pin_Nano; EndCmp BeginCmp TimeStamp = /551D9414; Reference = P3; ValeurCmp = CONN_1; IdModule = Socket_Arduino_Nano:1pin_Nano; EndCmp BeginCmp TimeStamp = /551D9380; Reference = P6; ValeurCmp = CONN_1; IdModule = Socket_Arduino_Nano:1pin_Nano; EndCmp BeginCmp TimeStamp = /551D9414; Reference = P4; ValeurCmp = Digital; IdModule = Socket_Arduino_Nano:1pin_Nano; EndCmp BeginCmp TimeStamp = /551D9380; Reference = P4; ValeurCmp = CONN_1; IdModule = Socket_Arduino_Nano:1pin_Nano; EndCmp BeginCmp TimeStamp = /551D9414; Reference = P5; ValeurCmp = CONN_1; IdModule = Socket_Arduino_Nano:1pin_Nano; EndCmp Hardware/PCB/precadsr/precadsr.kicad_pcb Normal file Unescape // testing futura vs quentincaps in F6 rendering module label(string, size=4, halign="center", font=default_label_font) { module v_wall(h, l, wall_thickness); Align panel to integer pseudo-origin, remove testing text, decrease title label font so we don't lose it Futura Heavy BT.ttf (grid_origin 84.5 17.5 Mark board for a single 0.5 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 0.15 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-4170, 17 Pins per row (http://www.molex.com/pdm_docs/sd/439151404_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 5 times 1 mm² wires, basic insulation, conductor diameter 1.7mm, size source Multi-Contact FLEXI-E 0.15 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator connector wire 0.127sqmm double-strain-relief Soldered wire connection, for 2 times 0.25 mm² wires, reinforced insulation, conductor diameter 0.9mm, outer diameter 2mm, size source Multi-Contact FLEXI-E 0.15 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket.
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