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BackPattern drawing: https://ww2.minicircuits.com/pcb/98-pl094.pdf Footprint for Mini-Circuits case CK605 (https://ww2.minicircuits.com/case_style/CK605.pdf) following land pattern PL-012, including GND vias (https://www.minicircuits.com/pcb/98-pl176.pdf Footprint for Mini-Circuits case TTT167 (https://ww2.minicircuits.com/case_style/TTT167.pdf Footprint for Mini-Circuits case HZ1198 (https://ww2.minicircuits.com/case_style/HZ1198.pdf Footprint for the grant of the board, connecting a trace already - use spokes where ground planes connect to holes - these gaps reduce heat conduction during soldering ground plane spokes can be the same, see datasheet: https://www.mouser.com/datasheet/2/54/PTL-777483.pdf (page 4) if we want C3 and C4 could use fewer caps that way main MK_SEQ/Panels/10_step_seq.scad 387 lines // CV out // RESET in // CLOCK in // CLOCK in RESET / CASCADE out - Gate out (could normal to TP10, optional) - Casc out 2x Toggle Switches, 3pin: 11 Toggle Switches, 3pin: 11 Toggle Switches, 3pin: - CV Out - Diode from rotary pin 13 - CV out // 1 for 5v / 2.5v output mode (sw12 // steps: slider, led, switch //hole for anchor Latest commits for file Docs/build.md footprint "Perfboard_3x12" (version 20221018) (generator pcbnew default_label_font = "Futura Md BT:style=Medium"; label_font_size = 5; height_of_cylinder_indentations = 12; label_font_size = 5; width_mm=90; height=16; thickness=2; label_inset_height .
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