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BackProcedure for assembly. As usual do the lowest components first — resistors and diodes — then sockets, ceramic capacitors, power header, transistors, film caps, electrolytic caps... Something like that. Latest commits for file Datasheets/2N3903-Motorola.pdf # Autorouter files (exported from Pcbnew *.ses # Exported BOM files *.xml *.csv # KiCad backups folders *-backups # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes.
- 1.00u, PCB mount, retention spring.
- (end 175.6975 119.9275 (end 181.89 121.04.
- 2021 ; DRILL file {KiCad 5.1.10-88a1d61d58~90~ubuntu20.04.1} date.