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0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 2x4 (perimeter) array, NSMD pad definition Appendix A BGA 484 1 FG484 FGG484 Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch.

• (UC) - 3x3x0.5 mm Body [DFN-S] (see Microchip.
• -2.341092e+000 2.473857e+001 facet normal.

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