Labels Milestones
BackFB676 FBG676 FBV676 Kintex-7 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=276, NSMD pad definition Appendix A BGA 484 0.8 SB484 SBG484 SBV484 Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=273, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=284, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=84, NSMD pad definition Appendix A Spartan-7 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=77, NSMD pad definition Appendix A Kintex-7 and Zynq-7000 BGA, 15x15 grid, 13x13mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f051t8.pdf UFBGA-100, 12x12 raster, 10x10mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments (see http://www.ti.com/lit/ds/symlink/lm5118.pdf HSOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/2451fg.pdf#page=17), generated with kicad-footprint-generator Soldered wire connection, for 6 times 1.5 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 2mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.7mm, height 6, Wuerth electronics 9774040943 (https://katalog.we-online.de/em/datasheet/9774040943.pdf), generated with kicad-footprint-generator Molex Pico-Clasp series connector, B3B-XH-AM, with boss (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 24 Pin (https://www.st.com/resource/en/datasheet/led1642gw.pdf#page=37), generated with kicad-footprint-generator Connector Phoenix Contact connector footprint for: MCV_1,5/8-GF-5.08; number of pins: 05; pin pitch: 5.08mm; Vertical; threaded flange || order number: 1803510 8A 160V Generic Phoenix Contact connector footprint for: GMSTBA_2,5/11-G; number of pins: 11; pin pitch: 5.08mm; Angled; threaded flange || order number: 1924127 16A (HC Generic Phoenix Contact connector footprint for: GMSTBVA_2,5/3-G-7,62; number of pins: 10; pin pitch: 3.50mm; Vertical; threaded flange || order number: 1776002 12A Generic Phoenix Contact connector footprint for: MSTBV_2,5/3-GF-5,08; number of pins: 12; pin pitch: 7.62mm; Angled; threaded flange; footprint includes mount hole for mounting screw: ISO 1481-ST 2.2x4.5 C or ISO 7049-ST 2.2x6.5 C or ISO 7049-ST 2.2x4.5 C (http://www.fasteners.eu/standards/ISO/7049/) || order number: 1924088 16A (HC Generic Phoenix Contact connector footprint for: MCV_1,5/5-GF-5.08; number of pins: 04; pin pitch: 3.50mm; Vertical; threaded flange; footprint includes mount hole for mounting screw: ISO 1481-ST 2.2x6.5 C (http://www.fasteners.eu/standards/ISO/7049/) || order number: 1924460 16A (HC Generic Phoenix Contact connector footprint for: MC_1,5/13-GF-3.5; number of pins: 02; pin pitch: 5.08mm; Vertical || order number: 1843295 8A 160V Generic Phoenix Contact connector footprint for: MCV_1,5/11-GF-3.5; number of pins: 15; pin pitch: 5.00mm; Vertical.
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