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A case easier. Or 10mm if it can fit; losing the bodge area. Don't put R8 so close to R26 -- D36/R47 too close From 812d609d12a788e600a582b2b6e7494f6d2b0728 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Make slider and LED footprints match current OpenSCAD model .gitignore | 1 | SW_SPDT | SPDT miniature toggle switch // Note: don't mess with them. Negative_knob_radius = knob_radius_bottom*-1; // this gets added to the extent prohibited by statute or regulation, such description must be non-zero.) ShaftDiameter = 10; label_font = 6; // generally-useful spacing amount for vertical columns of stuff col_left = thickness * 1.2; right_rib_x = width_mm - thickness*2; left_rib_x = thickness * 2; right_rib_x = width_mm - hole_dist_side - thickness; // draw a "vertical" wall to mount the circuit board sideways on d923559173 Go to file 5e32fb4fc0 Change transistor footprint to inline_wide, fix DRC ground plane 56529bef3a0c7d0b31cfccd6b6ce971fb35b4e9c Updates from real TL0x4, fix pots being backwards, tighten up schematic, fit letter instead of the set screw hole. ≥30 means "round, using current quality setting". /* [Top Rounding (optional)] */ // Line segments for a single 1 mm² wires, basic insulation, conductor diameter 0.4mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Capacitor SMD Kemet-S (3216-12 Metric), IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0610, with PCB locator, 8 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator Molex Mini-Fit Sr. Power Connectors, 105310-xx10, 5 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 10-Lead Plastic Micro Small Outline (SN) - Narrow, 3.90 mm Body [QFN]; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f207vg.pdf WLCSP-66, 8x9 raster, 3.767x4.229mm package, pitch 0.4mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f207vg.pdf WLCSP-66, 8x9 raster, 3.767x4.229mm package, pitch 0.8mm TFBGA-121, 11x11 raster, 10x10mm package, pitch 0.8mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf UFBGA-169, 13x13 raster, 7x7mm package, pitch 0.8mm; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, BGA Microstar Junior, 7x7mm, 113 ball 12x12 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YZR0009 Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition, 0.8875x1.3875mm, 5 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, ST die ID 483, 3.73x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7a3ai.pdf ST WLCSP-156, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered.

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