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WLCSP-81, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.55mm Pitch, https://www.dialog-semiconductor.com/sites/default/files/da1469x_datasheet_3v1.pdf#page=740 VFBGA-100, 10x10, 7x7mm package, pitch 0.4mm; see section 36.2.3 of http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-42363-SAM-D11_Datasheet.pdf WLCSP-56, 7x8 raster, 3.170x3.444mm package, pitch 0.8mm; see section 10.3 of https://www.parallax.com/sites/default/files/downloads/P8X32A-Propeller-Datasheet-v1.4.0_0.pdf 44-Lead Plastic Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, single row style2 pin1 right Through hole straight pin header, 2x15, 2.54mm pitch, double rows Surface mounted pin header SMD 1x11 2.54mm single row style1 pin1 left Surface mounted socket strip SMD 1x09 1.27mm single row style1 pin1 left Surface mounted socket strip THT 1x37 2.00mm single row style2 pin1 right Through hole IDC header, 2x17, 2.00mm pitch, 4.2mm pin length, single row style2 pin1 right Through hole angled pin header, 1x01, 1.00mm pitch, single row (from Kicad 4.0.7), script generated Through hole straight pin header, 2x38, 2.54mm pitch, double rows Through hole angled pin header SMD 2x13 1.00mm double row Through hole angled socket strip SMD 1x31 2.54mm single row Surface mounted socket strip THT 1x22 2.00mm single row style2 pin1 right Through hole angled socket strip, 1x11, 2.00mm pitch, double rows Through hole straight socket strip, 2x04, 2.00mm pitch, double rows Through hole angled socket strip, 2x08, 1.27mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole angled pin header THT 2x04 2.54mm double row Through hole pin header THT 1x23 2.54mm single row style2 pin1 right Through hole pin header SMD 2x20 1.00mm double row Through hole socket strip SMD 1x04 1.00mm single row Surface.

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