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MKDS-1,5-5, 5 pins, pitch 7.5mm, size 89x15mm^2, drill diamater 1.5mm, 2 pads, pad diameter 3mm, see , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block RND 205-00301, 5 pins, pitch 5.08mm, revamped version of bornier3 simple 4-pin terminal block, pitch 5.0mm, 45 degree angled, see http://www.mouser.com/ds/2/16/PCBMETRC-24178.pdf Altech AK300 terminal block, pitch 5.0mm, see https://diotec.com/tl_files/diotec/files/pdf/datasheets/b40r.pdf diode bridge Single phase bridge rectifier case 15.7x15.7 Single phase bridge rectifier case KBPC6, see http://www.vishay.com/docs/93585/vs-kbpc1series.pdf Vishay KBM rectifier diode bridge Thermal enhanced ultra thin fine pitch quad flat package (http://www.st.com/resource/en/datasheet/stm8s003f3.pdf ST UQFN 6 pin 0.5mm Pitch http://www.st.com/resource/en/datasheet/ecmf02-2amx6.pdf UQFN DFN 0.5 Qorvo 2x2mm DFN package size 11.5x8.5x17.5mm^3, https://www.recom-power.com/pdf/Innoline/R-78HBxx-0.5_L.pdf DCDC-Converter, RECOM, RECOM_R-78E-0.5, SIP-3, pitch 2.54mm, size 28.4x6.5mm^2, drill diamater 1.3mm, pad diameter 2.6mm, see http://www.farnell.com/datasheets/100425.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block RND 205-00076 pitch 7.5mm size 22.5x11mm^2 drill 1.4mm pad 2.6mm Terminal Block WAGO 236-616, 45Degree (cable under 45degree), 8 pins, pitch 5.08mm, size 35.6x11.2mm^2, drill diamater 1.3mm, pad diameter 3mm, size source Multi-Contact FLEXI-xV 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py PQFP256 28x28 / QFP256J CASE 122BX (see ON Semiconductor 506CN.PDF DC8 Package 8-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Thin Quad Flatpack (PF) - 14x14mm body, 9.5mm sq thermal pad TSSOP HTSSOP 0.65 thermal pad HTSSOP32: plastic thin shrink small outline package; 28 leads; body width 16.90 mm Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 20-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), LongPads 48-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 6-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 8-Lead, 300\" Wide, Surface Mount Double Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-7812045, 20 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/atmel-8153-8-and-16-bit-avr-microcontroller-xmega-e-atxmega8e5-atxmega16e5-atxmega32e5_datasheet.pdf#page=70), generated with kicad-footprint-generator JST SH series connector, B6B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 6 times 0.15 mm² wires, basic insulation, conductor diameter.

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