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Bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 468, 3.15x3.13mm, 49 Ball, 7x7 Layout.

• 4.863034e-03 -2.223328e-01 vertex -9.048011e+01 1.009180e+02 1.177033e+01.
• Adds ideas for a single 0.1.
• Handsoldering Diode SMA (DO-214AC) Handsoldering.

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