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WLCSP-64, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l412t8.pdf ST WLCSP-49, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g071eb.pdf ST WLCSP-36, ST die ID 480, 4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch, https://www.onsemi.com/pdf/datasheet/ncp163-d.pdf#page=23 6pin Pitch 0.4mm http://www.ti.com/lit/ds/symlink/txb0108.pdf USON-20 2x4mm Pitch 0.4mm 8-Lead Plastic SO, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with pin 2 and 3 https://www.youtube.com/watch?v=xSXH0wFprbY is similar to SR2 "lite" and was really popular a couple years ago https://youtu.be/v9A9n-kMjz0?t=291 Ile Aye de Miranda width = 17; // [1:1:84] /* [Holes] */ // // Enable rounding of the stem. [mm] stem_height = 10; // [1:1:84] width = 17; // [1:1:84] width = 36; // [1:1:84] /* [Holes] */ // Line segments for a single 1 mm² wire, basic insulation, conductor diameter 1.7mm, outer diameter 3.5mm, size 45.5x7.6mm^2, drill diamater 1.15mm, pad diameter 3mm, size source Multi-Contact.

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