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(http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (perimeter) array, NSMD pad definition Appendix A BGA 1924 1 FF1926 FFG1926 FF1927 FFG1927.

• 46007-1102, With thermal vias in pads, 4 Pins.
• Vertex -9.277787e+01 9.337724e+01 4.255000e+01.

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