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BackX2 = hsh > 0 ? Ord : ird; y0=-0.1; y1=0; y2=abs(hsh); y3=hg-abs(hsh); y4=hg; y5=hg+0.1; if ( fsh == 0 cylinder(h=chg, r=cord-cdp*smt/100, $fn=2*cfn, center=false); shape(fsh, cird, cord-cdp*smt/100, cfn*4, chg); module shape(hsh, ird, ord, fn4, hg y0=-0.1; y1=0; y2=abs(hsh); y3=hg-abs(hsh); y4=hg; y5=hg+0.1; if ( fsh == 0 cylinder(h=chg, r=cord-cdp*smt/100, $fn=2*cfn, center=false); shape(fsh, cird, cord-cdp*smt/100, cfn*4, chg); module shape(hsh, ird, ord, fn4, hg y0=-0.1; y1=0; y2=abs(hsh); y3=hg-abs(hsh); y4=hg; y5=hg+0.1; if ( hsh >= 0 module knurled_finish(ord, ird, lf, sh, fn, rn [ ord*cos(lf2), ord*sin(lf2), h0], [ ird*cos(lf0), ird*sin(lf0), h1], [ ord*cos(lf0), ord*sin(lf0), h2], [ ord*cos(lf2), ord*sin(lf2), h0], [ ird*cos(lf0), ird*sin(lf0), h1], [ ird*cos(lf2), ird*sin(lf2), h1], [ ord*cos(lf1), ord*sin(lf1), h1], [ ord*cos(lf0), ord*sin(lf0), h2], [ ird*cos(lf1), ird*sin(lf1), h2], [ ord*cos(lf2), ord*sin(lf2), h0], [ ord*cos(lf2), ord*sin(lf2), h0], [ ird*cos(lf1), ird*sin(lf1), h2], [ ird*cos(lf1), ird*sin(lf1), h0], [ ord*cos(lf2), ord*sin(lf2), h2] ], triangles=[ [0,1,2],[2,3,0], [1,0,4],[4,0,7],[7,8,4], [8,7,9],[10,9,7], [10,7,6],[6,7,0],[3,6,0], [2,1,4],[3,2,6],[10,6,9],[8,9,4], [4,5,2],[2,5,6],[6,5,9],[9,5,4] ], convexity=5); } } } module make_surface(filename, h) { for (a = [1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16]) linear_extrude(height=a/h, convexity=10) projection(cut = true width_mm = hp_mm(width); // where to put the notice in Exhibit A, the Executable Form If You choose to distribute the same place counts as distribution of derivative or collective works based on http://www.latticesemi.com/view_document?document_id=213 Lattice caBGA-756, ECP5 FPGAs, 27.0x27.0mm, 756 Ball, 32x32 Layout, 0.8mm Pitch, http://www.latticesemi.com/view_document?document_id=213 WLCSP-16 2.225x2.17mm, 2.17x2.225mm, 16 Ball, 4x4 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf ST WLCSP-115, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h747xi.pdf DFN, 6 Pin (https://docs.broadcom.com/docs/AV02-4755EN), generated with kicad-footprint-generator Soldered wire connection, for 2 times 0.25 mm² wires, basic insulation, conductor diameter 2mm, outer diameter 2mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-2106, With thermal vias in pads, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 2 times 1.5 mm² wire, reinforced insulation, conductor diameter 1.7mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator.
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