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IHB-3, http://www.vishay.com/docs/34015/ihb.pdf Inductor Radial series Radial pin pitch 10.00mm diameter 12.5mm height 12.5mm Resistor, Axial_Power series, Box, pin pitch=45.72mm, 9W, length*width*height=38*9*9mm^3, http://cdn-reichelt.de/documents/datenblatt/B400/5WAXIAL_9WAXIAL_11WAXIAL_17WAXIAL%23YAG.pdf Resistor Axial_Power series Box pin pitch 10.00mm length 13mm width 5mm L_Toroid, Vertical series, Radial, pin pitch=48.26mm, , diameter=40mm L_Toroid Horizontal series Radial pin pitch 45mm length 42mm diameter 35.0mm Electrolytic Capacitor CP, Axial series, Axial, Horizontal, pin pitch=15.24mm, 1W, length*diameter=9.9*3.6mm^2 Resistor Axial_DIN0411 series Axial Horizontal pin pitch 12.7mm length 7.6mm diameter 3.6mm Resistor, Axial_DIN0411 series, Axial, Horizontal, pin pitch=15mm, , length*diameter=12*10.5mm^2, http://cdn-reichelt.de/documents/datenblatt/B300/STYROFLEX.pdf C Axial series Axial Vertical pin pitch 7.50mm length 10mm width 3mm Capacitor C, Rect series, Radial, pin pitch=5.00mm, , diameter=12.5mm, Electrolytic Capacitor CP Radial series Radial pin pitch 2.54mm size 13.16x6.5mm^2 drill 1.1mm pad 2.1mm terminal block (Script generated with kicad-footprint-generator Capacitor SMD AVX-R (7260-15 Metric), IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator Hirose DF13 through hole, DF13-07P-1.25DSA, 7 Pins per row, Mounting: (http://www.molex.com/pdm_docs/sd/039281043_sd.pdf), generated with kicad-footprint-generator connector JST XH series connector, SM06B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 16-Lead Plastic TSSOP (4.4mm); Exposed Pad (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 14 leads; body width 16.90 mm Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 22-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 32-lead surface-mounted (SMD.

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