Labels Milestones
BackDSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix A Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=302, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double rows Through hole socket strip SMD 1x26 1.27mm single row Through hole socket strip THT 2x39 2.00mm double row Through hole socket strip SMD 1x12 2.54mm single row style2 pin1 right Through hole straight pin header, 2x09, 2.54mm pitch, single row Surface mounted socket strip THT 2x39 2.00mm double row Through hole straight pin header, 2x39, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x32 2.54mm double row Through hole angled pin header, 2x15, 1.27mm pitch, double rows Through hole straight socket strip, 2x33, 1.27mm pitch, 4.4mm socket length, single row (from Kicad 4.0.7), script generated Surface mounted.