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BackPins package 1x0.8mm pitch 0.35mm SOT-1123 small outline package; 8 leads; body width 3.9 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 10 leads; body width 16.90 mm Power-Integrations variant of 8-Lead Plastic Stretched Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP.
- 5 | 22k | Resistor.
- Vertex -4.038048e+000 7.699408e-001 2.480400e+001 facet.
- 0.469149 0.877714 0.0975597 facet normal -4.747855e-001.