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Semiconductor 506BU.PDF 8-Lead Plastic Dual Flat, No Lead Package, 1.2x1.8x1.55 mm Body [VDFN] (see Microchip Packaging Specification 00000049BS.pdf SSOP, 32 Pin (JEDEC MO-153 Var EA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Samtec HLE .100.

• 32.3x14mm^2, drill diamater 1.3mm, pad diameter.
• Placement Fix rail clearance = ~11.675mm, top and.

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