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Package (MA) - 2x2x0.9 mm Body [TQFP] With 4.5x4.5 mm Exposed Pad (see https://www.diodes.com/assets/Package-Files/SO-8EP.pdf 20-Lead Plastic Thin Shrink Small Outline Package (MS) [MSOP], variant of TO-92), also known as TO-226, wide, drill 0.75mm (see https://www.diodes.com/assets/Package-Files/TO92L.pdf and http://www.ti.com/lit/an/snoa059/snoa059.pdf TO-92L Inline Wide transistor TO-92L leads in-line (large body variant of 8-Lead Plastic SO, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with missing pin 5, row spacing 9.53 mm (375 mils), Clearance8mm 10-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 24-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 10x-dip-switch SPST Copal_CHS-10A, Slide, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 12x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 6.7x21.88mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 12x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), Socket 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 28-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 7x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils 20-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 4-lead surface-mounted (SMD) DIP package, row spacing 22.86 mm (900 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 6x-dip-switch SPST Omron_A6S-610x, Slide, row spacing 10.16 mm (400 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 22.86mm 900mil LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 24-lead though-hole mounted DIP package, row spacing 7.62.

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