Labels Milestones
BackSmallPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 32-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 22-lead.
- 5.40904 7.37319 vertex 0.672644 -6.71541 7.35649 vertex.
- For: MC_1,5/7-GF-3.81; number of pins: 09; pin pitch.