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Connector, B02P-NV (http://www.jst-mfg.com/product/pdf/eng/eNV.pdf), generated with kicad-footprint-generator Molex PicoBlade series connector, B09B-ZESK-D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator JST J2100 series connector, B9B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF11-32DP-2DSA, 16 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf), generated with kicad-footprint-generator JST ZE series connector, B6B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 6 times 2 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502426-2410, 24 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 2 times 0.25 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 3mm, size source Multi-Contact FLEXI-E 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Straight solder pin 1 x 1 mm, 734-134 , 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole ST Morpho Connector 144 With STLink ST Morpho Connector 144 STLink AI accelerated MCU with optional wifi, https://dl.sipeed.com/MAIX/HDK/Sipeed-M1&M1W/Specifications AI Kendryte K210 RISC-V Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole socket strip THT 2x22 2.54mm double row Through hole straight pin header, 2x02, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip THT 1x02 2.00mm single row Surface mounted socket strip THT 1x06 1.00mm single row Surface mounted socket strip THT 1x34 2.00mm single row (from Kicad 4.0.7), script generated Through hole socket strip SMD 1x30 1.27mm single row Through hole angled socket strip, 1x21, 1.00mm pitch, double rows Through hole angled pin header THT 2x25 2.00mm double row surface-mounted straight socket strip, 1x24, 2.54mm pitch, double rows Through hole straight socket strip, 1x16, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf SMD vertical IDC box header THT 2x01 1.27mm double row surface-mounted straight pin header, 2x19, 1.00mm pitch, double rows Through hole angled socket strip, 2x34, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip THT 1x32 1.27mm single row style2 pin1 right Through hole angled pin header SMD 1x38 1.27mm single row Through hole angled pin header THT 2x20 1.00mm double row Through hole angled pin.

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