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Panel socket, through-hole, row spacing 7.62 mm (300 mils 20-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 16-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 2x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket 16-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 32-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 5.08mm, pin-spacing 2.54mm, see https://www.vishay.com/docs/66542/to-220-1.pdf TO-220-3 Horizontal RM 1.7mm Pentawatt Multiwatt-5 TO-220-5, Vertical, RM 1.27mm, staggered type-2, see https://www.njr.com/semicon/PDF/package/TO-220F-4_E.pdf TO-220F-4 Horizontal RM 0.97mm Multiwatt-9 staggered type-1 TO-220-7, Horizontal, RM 2.54mm, see https://www.vishay.com/docs/66542/to-220-1.pdf TO-220-3 Vertical RM 0.97mm Multiwatt-9 staggered type-1 TO-220-5, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 7.62mm 300mil Socket 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x16.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 2x-dip-switch SPST Copal_CHS-02A, Slide, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 32-lead though-hole mounted high-volatge DIP package (based on standard DIP-4), row spacing 7.62 mm (300 mils), body size 6.7x9.18mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 3x-dip-switch SPST KingTek_DSHP03TJ, Slide, row spacing 15.24 mm (600 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 22-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 32-lead surface-mounted (SMD) DIP package, row spacing 22.86 mm (900 mils THT DIP DIL PDIP 2.54mm 25.4mm 1000mil LongPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 22-lead though-hole mounted DIP package, row spacing 24.13 mm (950 mils), SMDSocket, SmallPads 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 16-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 5-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size 6.7x32.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 4x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), missing pin 7 removed (Microchip Packaging Specification 00000049BS.pdf HSOP, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/20005045C.pdf#page=23), generated with kicad-footprint-generator JST XH series connector, 14110713002xxx (https://b2b.harting.com/files/download/PRD/PDF_TS/1411XX13002XXX_100228421DRW035C.pdf), generated.

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