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Connector, 14110913001xxx (https://b2b.harting.com/files/download/PRD/PDF_TS/1411XX13001XXX_100228421DRW046C.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 09-65-2038, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 5566-16A2, example for new part number: 26-60-4030, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF11-24DP-2DSA, 12 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 56 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00002142A.pdf#page=40), generated with kicad-footprint-generator JST SUR series connector, BM08B-GHS-TBT (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6 times 0.15 mm² wires, basic insulation, conductor diameter 1.4mm, outer diameter 1.7mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Hirose DF13 vertical Hirose DF63 through hole, DF11-6DP-2DSA, 3 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator XP_POWER ITxxxxxS SIP DCDC-Converter XP_POWER ITXxxxxSA, SIP, (https://www.xppower.com/pdfs/SF_ITX.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 54722-0224, 22 Pins per row.

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